3Com Corporation
ABLE Communications
Acorn Computers Limited
Adaptec, Inc.
Adax, Inc.
Addmaster Corporation
Advanced Digital Corporation
Advanced Micro Devices
Advanced Scientific Instruments, Inc.
Alpha Microsystems
Altos Computer Systems
Ampro Computers, Inc.
Analogic Corporation
Apollo Computer, Inc.
Apple Computer
Applied Digital Data Systems
Applied Microsystems Corporation
Archive Corporation
Artec Electronics, Inc.
AT&T Information Systems
Beehive International
Bondwell Holding Ltd.
Burroughs Corporation
C. Itoh Electronics
California Computer Products, Inc. (CalComp)
California Computer Systems
Central Data Corporation
Centronics
Centronics Data Computer Corp.
Century Data Systens
Citizen
CompuPro
Computer Control Company
Compu/Time
Control Data Corporation
Corvus Systems, Inc.
Cromemco, Inc.
Data Dynamics Ltd.
Data Electronics, Inc.
Data General Corporation
Data I/O Corporation
Data Systems Design, Inc.
Datapoint Corporation
Dataproducts Corporation
Diablo Systems, Inc.
Digital Equipment Corporation
Digital Research, Inc.
Digitronics Corporation
Distributed Logic Corporation (Dilog)
Documation, Inc.
Dual Systems Corporation
DY 4 Systems Inc.
Emulex Corporation
Epson
Facit
Ferranti Ltd.
John Fluke Mfg. Co., Inc.
GRI Computer Corporation
Hayes Microcomputer Products, Inc.
Hazeltine Corporation
Heath/Zenith
Hewlett-Packard
Honeywell Information Systems Inc.
INMOS Limited
Intel Corporation
Interdata/Perkin-Elmer
International Business Machines
International Computers and Tabulators Limited
Kimtron Corporation
A/S Kongsberg Våpenfabrikk
Lear Siegler, Inc.
Megatek Corporation
MITS, Inc.
Moore Corporation
Morrow Designs
Motorola
National Semiconductor Corporation
Nixdorf Computer Corporation
Oki Electric Industry Company, Ltd.
Osborne Computer Corporation
Prime Computer, Inc.
Qume Corporation
Random Corporation
Research, Inc.
Research Machines
S&H Computer Systems, Inc.
Seattle Computer Products, Inc.
Shugart Associates
Soroc Technology, Inc.
Sun Microsystems, Inc.
Tandy Corporation
Tektronix
Teletype Corporation
TeleVideo
Texas Instruments
Vector Graphics, Inc.
Visual Technology Inc.
VLSI Technology, Inc.
Volker-Craig Ltd.
Western Digital Corporation
Wyse Technology
Xebec Systems, Inc.
Xerox Corporation
Zilog, Inc.
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DELNI Ethernet Local Network Interconnect Technical Manual
Company:
Digital Equipment Corporation
Part:
EK-DELNI-TM-001
Date:
1984-07
Table of Contents
Chapter 1
Introduction
1.1
Digital Ethernet Local Network Interconnect (DELNI) Overview
1.1.1
Communication Interfaces
1.1.2
Operating Modes/Operational Communication Interfaces
1.1.3
Operational Applications
1.2
DELNI Functional Description
1.2.1
LOCAL Mode Operation
1.2.2
GLOBAL Mode Operation
1.3
DELNI Physical Description
1.3.1
Physical Characteristics
1.3.2
Configurations
1.4
DELNI Controls, Indicators, and Fusing
1.4.1
Controls and Indicators
1.4.2
Fusing
1.4.3
Spare Fuses and Fuse Holders
1.5
DELNI Rack Mount Option
1.6
Related Documentation
Chapter 2
DELNI Network Configuration Guidelines
2.1
Configuration Guidelines
2.1.1
Standalone DELNI LAN
2.1.2
Two-Tier DELNI LAN
2.1.3
Connected DELNI LAN
2.2
Configuration Limitations
Chapter 3
DELNI Interfaces, Input/Output Signal Flow, and Specifications
3.1
Communication Interfaces
3.1.1
Local Connector Interfaces
3.1.2
Global Connector Interfaces
3.2
Input/Output Signal Flow and Timing Relationships
3.2.1
LOCAL Mode Signal Flow and Timing Relationships
3.2.2
GLOBAL Mode Signal Flow and Timing Relationships
3.3
Input/Output Circuit and Signal Characteristics
3.3.1
CHn TRANSMIT Pair Signal Requirements
3.3.2
CHn TRANSMIT Pair Circuit Response
3.3.3
CHn RECEIVE Pair Circuit Characteristics
3.3.4
CHn RECEIVE Pair Signal Characteristics
3.3.5
CHn COLLISION PRESENCE Pair Circuit Characteristics
3.3.6
CHn COLLISION PRESENCE Pair Signal Characteristics
3.3.7
XCVR TRANSMIT Pair Circuit Characteristics
3.3.8
XCVR TRANSMIT Pair Signal Characteristics
3.3.9
XCVR RECEIVE Pair Signal Requirements
3.3.10
XCVR RECEIVE Pair Circuit Response
3.3.11
XCVR COLLISION PRESENCE Pair Signal Requirements
3.3.12
XCVR COLLISION PRESENCE Pair Circuit Response
3.3.13
XCVR POWER Pair Characteristics
3.3.14
XCVR POWER Pair External Load Requirements
3.4
Input Power Requirements
3.5
Environmental Requirements
Chapter 4
Functional Theory of Operation
4.1
DELNI Circuit Characteristics
4.1.1
Power Supply
4.1.2
Operating Mode Control
4.1.3
Local Connector Interface
4.1.4
Data Concentrator
4.1.5
Data Router
4.1.6
Data Presence and Local Collision Detector
4.1.7
Data Enable/Local Collision Control
4.1.8
Local Heartbeat Timers
4.1.9
Local/Global Heartbeat and Collision Signaling Control
4.1.10
10 MHz Oscillator
4.1.11
Global XMIT Data Substitute
4.1.12
Global Connector Interface
4.2
DELNI Functional Operation
4.2.1
LOCAL Mode Functional Theory
4.2.1.1
Transmit/Receive
4.2.1.2
Local Heartbeat Signaling
4.2.1.3
Local Collision Detection
4.2.1.4
Local Collision Signaling
4.2.2
GLOBAL Mode Functional Theory
4.2.2.1
Transmit
4.2.2.2
Local Collision Detection
4.2.2.3
Local Collision Condition Data Control and Collision Signaling
4.2.2.4
Receive
4.2.2.5
Global Collision and Heartbeat Signal Detection
4.2.2.6
Global Collision and Heartbeat Signaling
Chapter 5
Module Removal and Replacement Instructions
5.1
Logic Module Removal Procedure
5.2
Connector Board Removal Procedure
5.3
Connector Board Installation Procedure
5.4
Logic Module Installation Procedure
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