3Com Corporation
ABLE Communications
Acorn Computers Limited
Adaptec, Inc.
Adax, Inc.
Addmaster Corporation
Advanced Digital Corporation
Advanced Micro Devices
Advanced Scientific Instruments, Inc.
Alpha Microsystems
Altos Computer Systems
Ampro Computers, Inc.
Analogic Corporation
Apollo Computer, Inc.
Apple Computer
Applied Digital Data Systems
Applied Microsystems Corporation
Archive Corporation
Artec Electronics, Inc.
AT&T Information Systems
Beehive International
Bondwell Holding Ltd.
Burroughs Corporation
C. Itoh Electronics
California Computer Products, Inc. (CalComp)
California Computer Systems
Central Data Corporation
Centronics
Centronics Data Computer Corp.
Century Data Systens
Citizen
CompuPro
Computer Control Company
Compu/Time
Control Data Corporation
Corvus Systems, Inc.
Cromemco, Inc.
Data Dynamics Ltd.
Data Electronics, Inc.
Data General Corporation
Data I/O Corporation
Data Systems Design, Inc.
Datapoint Corporation
Dataproducts Corporation
Diablo Systems, Inc.
Digital Equipment Corporation
Digital Research, Inc.
Digitronics Corporation
Distributed Logic Corporation (Dilog)
Documation, Inc.
Dual Systems Corporation
DY 4 Systems Inc.
Emulex Corporation
Epson
Facit
Ferranti Ltd.
John Fluke Mfg. Co., Inc.
GRI Computer Corporation
Hayes Microcomputer Products, Inc.
Hazeltine Corporation
Heath/Zenith
Hewlett-Packard
Honeywell Information Systems Inc.
INMOS Limited
Intel Corporation
Interdata/Perkin-Elmer
International Business Machines
International Computers and Tabulators Limited
Kimtron Corporation
A/S Kongsberg Våpenfabrikk
Lear Siegler, Inc.
Megatek Corporation
MITS, Inc.
Moore Corporation
Morrow Designs
Motorola
National Semiconductor Corporation
Nixdorf Computer Corporation
Oki Electric Industry Company, Ltd.
Osborne Computer Corporation
Prime Computer, Inc.
Qume Corporation
Random Corporation
Research, Inc.
Research Machines
S&H Computer Systems, Inc.
Seattle Computer Products, Inc.
Shugart Associates
Soroc Technology, Inc.
Sun Microsystems, Inc.
Tandy Corporation
Tektronix
Teletype Corporation
TeleVideo
Texas Instruments
Vector Graphics, Inc.
Visual Technology Inc.
VLSI Technology, Inc.
Volker-Craig Ltd.
Western Digital Corporation
Wyse Technology
Xebec Systems, Inc.
Xerox Corporation
Zilog, Inc.
About
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MicroVAX Site Preparation
Company:
Digital Equipment Corporation
Part:
EK-239AC-SP-003
Date:
1989-03
Table of Contents
Chapter 1
Physical Requirements
1.1
When Your Shipment Arrives
1.2
Space Requirements
1.2.1
Space for Additional Equipment and Cabling
1.3
Operating Environment
1.3.1
Static Electricity
1.3.2
Temperature and Humidity Ranges
1.3.3
Electrical Requirements
1.3.4
Acoustics
Chapter 2
Site Preparation Specifications
2.1
Specifications for the BA23 System
2.1.1
Dimensions
2.1.2
Heat, Humidity, Electrical Requirements, and Acoustics
2.2
Specifications for the BA123 System
2.2.1
Dimensions
2.2.2
Heat, Humidity, Electrical Requirements, and Acoustics
2.3
Specifications for the BA213 System and the B213A/B213F Expander
2.3.1
Dimensions
2.3.2
Heat, Humidity, Electrical Requirements, Power Cables, and Acoustics
2.3.3
B213A Expander and B213F Expander: Additional Power Requirements
2.4
Specifications for the BA215 System and the R215F Expander
2.4.1
Dimensions
2.4.2
Heat, Humidity, Electrical Requirements, and Acoustics
2.5
Specifications for the H9642 Cabinet
2.5.1
Dimensions
2.5.2
Heat, Humidity, Electrical Requirements, and Acoustics
2.6
Specifications for the H9644 Cabinet
2.6.1
Dimensions
2.6.2
Heat, Humidity, Electrical Requirements, and Acoustics
Appendix
Power Cable Order Numbers
Copies
Address:
http://vt100.net/mirror/hcps/239acsp3.pdf
Site:
Paul Williams' VT100.net
Format:
PDF
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11299377 bytes (10.8 MiB)
Comments, queries or problems to <
manx@celigne.co.uk
>
